Patent Assignment
Reel/Frame 064885/0112
Assignment of Assignor's Interest
Recorded: 2023-09-13
Pages: 3
Assignor
RESONAC CORPORATION
Executed: 2023-09-05
Assignee
NIPPON POLYTECH CORP.
370-1, NIBUKATA-MACHI, HACHIOJI-SHI, TOKYO, 193-0822, JAPAN
Covered Properties
(3)
Positive-Type Photosensitive Resin Composition and Partition Wall of Organic El Element
Application:
17/596,046 →
Publication:
US 2022/0326614
Photosensitive Resin Composition and Organic El Element Partition Wall
Application:
17/613,384 →
Publication:
US 2022/0221790
Photosensitive Resin Composition and Organic El Element Partition Wall
Application:
17/637,622 →
Publication:
US 2022/0275241
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2021
From: ARAI, YOSHIKAZU
To: SHOWA DENKO K.K.
Reel/Frame 058952/0160 →
Assignment of Assignor's Interest
Dec 2, 2021
From: ISHIDA, YASUHIRO; FURUE, KENTARO; ARAI, YOSHIKAZU; IWASAKI, MITSUHIRO
To: SHOWA DENKO K.K.
Reel/Frame 058296/0957 →
Assignment of Assignor's Interest
Feb 23, 2022
From: FURUE, KENTARO; ARAI, YOSHIKAZU
To: SHOWA DENKO K.K.
Reel/Frame 059077/0676 →
Change of Name
Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →