IP Library Assignment 058952/0160
Patent Assignment
Reel/Frame 058952/0160

Assignment of Assignor's Interest

Recorded: 2021-12-01 Pages: 2
Assignor
ARAI, YOSHIKAZU
Executed: 2021-07-21
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Photosensitive Resin Composition and Organic El Element Partition Wall
Application: 17/613,384 →
Publication: US 2022/0221790
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Assignment of Assignor's Interest Sep 13, 2023
From: RESONAC CORPORATION
To: NIPPON POLYTECH CORP.
Reel/Frame 064885/0112 →