Patent Assignment
Reel/Frame 058340/0412
Assignment of Assignor's Interest
Recorded: 2021-12-08
Pages: 3
Assignors
GSTREIN, FLORIAN
Executed: 2017-04-28
HOURANI, RAMI
Executed: 2017-04-28
BHIMARASETTI, GOPINATH
Executed: 2017-04-26
BLACKWELL, JAMES M.
Executed: 2017-04-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Bottom-Up Fill Dielectric Materials for Semiconductor Structure Fabrication and Their Methods of Fabrication