Patent Assignment
Reel/Frame 058344/0087
Assignment of Assignor's Interest
Recorded: 2021-12-09
Pages: 5
Assignors
SHIBATA, TOMOAKI
Executed: 2021-11-24
OGAWA, TSUYOSHI
Executed: 2021-12-06
LI, XINRONG
Executed: 2021-11-29
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Manufacturing Electronic Component Device, and Electronic Component Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.