Patent Assignment
Reel/Frame 058405/0976
Assignment of Assignor's Interest
Recorded: 2021-12-16
Pages: 5
Assignors
MCKNIGHT-MACNEIL, CAMERON
Executed: 2021-12-07
MIZAN, AHMAD
Executed: 2021-12-02
ABOUIE, MARYAM
Executed: 2021-12-06
Assignee
GAN SYSTEMS INC.
1145 INNOVATION DR., OTTAWA, K2K 3G8, CANADA
Covered Property
(1)
Solder Resist Structure for Embedded Die Packaging of Power Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.