Patent Assignment
Reel/Frame 058412/0829
Assignment of Assignor's Interest
Recorded: 2021-12-17
Pages: 6
Assignors
SHIN, KEUNWOOK
Executed: 2021-10-20
SEOL, MINSU
Executed: 2021-10-20
KIM, SANGWON
Executed: 2021-10-20
BYUN, KYUNG-EUN
Executed: 2021-10-20
SHIN, HYEONJIN
Executed: 2021-10-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnect Structure, Electronic Device Including the Same, and Method of Manufacturing Interconnect Structure