Patent Assignment
Reel/Frame 058426/0374
Assignment of Assignor's Interest
Recorded: 2021-12-20
Pages: 10
Assignors
LIN, SHIH-JIE
Executed: 2021-12-10
TENG, CHING-WEN
Executed: 2021-12-10
HUANG, KUO LIANG
Executed: 2021-12-10
TAN, WEN YI
Executed: 2021-12-10
Assignee
UNITED SEMICONDUCTOR (XIAMEN) CO., LTD.
NO.899 WAN JIA CHUN ROAD, XIAMEN XIANG'AN, XIAMEN, FUJIAN, CHINA
Covered Property
(1)
Cleaning process of wafer polishing pad and cleaning nozzle