Patent Assignment
Reel/Frame 058434/0785
Assignment of Assignor's Interest
Recorded: 2021-12-20
Pages: 6
Assignors
EDELSTEIN, DANIEL C.
Executed: 2014-08-21
NGUYEN, SON V.
Executed: 2014-08-20
NOGAMI, TAKESHI
Executed: 2014-08-20
PRIYADARSHINI, DEEPIKA
Executed: 2014-08-20
SHOBHA, HOSADURGA
Executed: 2014-08-20
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
1 ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method of Forming Copper Interconnect Structure with Manganese Barrier Layer
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 20, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 058434/0848 →
Change of Name
Aug 3, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061067/0709 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →