IP Library Assignment 061067/0709
Patent Assignment
Reel/Frame 061067/0709

Change of Name

Recorded: 2022-08-03 Pages: 6
Assignor
TESSERA, INC.
Executed: 2021-10-01
Assignee
TESSERA LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (19)
Sram Design to Facilitate Single Fin Cut in Double Sidewall Image Transfer Process
Patent: 49,794 →
Application: 17/066,281 →
Semiconductor Interconnect Structure with Double Conductors
Application: 17/068,230 →
Publication: US 2021/0043563
Method and Structure for Forming Dielectric Isolated Finfet with Improved Source/Drain Epitaxy
Application: 17/102,098 →
Publication: US 2021/0104620
Minimizing Shorting Between Finfet Epitaxial Regions
Application: 17/175,340 →
Publication: US 2021/0183856
Semiconductor Device with Reduced via Resistance
Application: 17/187,390 →
Publication: US 2021/0183699
Selective Ild Deposition for Fully Aligned via with Airgap
Application: 17/215,314 →
Publication: US 2021/0217653
Fabrication of a Vertical Fin Field Effect Transistor with Reduced Dimensional Variations
Application: 17/306,669 →
Publication: US 2021/0272854
Field Effect Transistor Structures
Application: 17/313,700 →
Publication: US 2021/0280674
Self Aligned Pattern Formation Post Spacer Etchback in Tight Pitch Configurations
Application: 17/328,569 →
Publication: US 2021/0280422
Nanosheet Transistor
Application: 17/328,674 →
Publication: US 2021/0280688
Semiconductor Device Including a Porous Dielectric Layer, and Method of Forming the Semiconductor Device
Application: 17/341,112 →
Publication: US 2021/0335706
Nanosheet Channel-to-Source and Drain Isolation
Application: 17/345,339 →
Publication: US 2021/0305405
Two-Color Self-Aligned Double Patterning (Sadp) to Yield Static Random Access Memory (Sram) and Dense Logic
Application: 17/360,819 →
Publication: US 2021/0343536
Forming Nanosheet Transistor Using Sacrificial Spacer and Inner Spacers
Application: 17/465,135 →
Publication: US 2021/0399114
Finfet Devices
Application: 17/482,903 →
Publication: US 2022/0013413
Forming a Sacrificial Liner for Dual Channel Devices
Application: 17/511,134 →
Publication: US 2022/0069118
Advanced Copper Interconnects with Hybrid Microstructure
Application: 17/546,511 →
Publication: US 2022/0165620
Method of Forming Copper Interconnect Structure with Manganese Barrier Layer
Application: 17/556,382 →
Publication: US 2022/0115269
Selective Recessing to Form a Fully Aligned Via
Application: 17/571,814 →
Publication: US 2022/0181205
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 12, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 054028/0133 →
Assignment of Assignor's Interest Oct 12, 2020
From: BRIGGS, BENJAMIN D.; NOGAMI, TAKESHI; PATLOLLA, RAGHUVEER R.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 054028/0099 →
Assignment of Assignor's Interest Nov 19, 2020
From: WEYBRIGHT, MARY E.; WONG, ROBERT C.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 054421/0357 →
Assignment of Assignor's Interest Nov 19, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 054421/0447 →
Assignment of Assignor's Interest Nov 23, 2020
From: CHENG, KANGGUO; LI, JUNTAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 054449/0564 →
Assignment of Assignor's Interest Nov 23, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 054449/0601 →
Assignment of Assignor's Interest Feb 12, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 055249/0818 →
Assignment of Assignor's Interest Feb 12, 2021
From: CHENG, KANGGUO; PRANATHARTHIHARAN, BALASUBRAMANIAN; REZNICEK, ALEXANDER; SURISETTY, CHARAN V.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 055249/0797 →
Assignment of Assignor's Interest Feb 26, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 055432/0983 →
Assignment of Assignor's Interest Feb 26, 2021
From: MURRAY, CONAL E.; YANG, CHIH-CHAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 055437/0567 →
Assignment of Assignor's Interest Mar 29, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 055751/0157 →
Assignment of Assignor's Interest Mar 29, 2021
From: PENNY, CHRISTOPHER J.; BRIGGS, BENJAMIN D.; HUANG, HUAI; CLEVENGER, LAWRENCE A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 055751/0091 →
Assignment of Assignor's Interest May 3, 2021
From: CHENG, KANGGUO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 056119/0065 →
Assignment of Assignor's Interest May 3, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 056119/0176 →
Assignment of Assignor's Interest May 6, 2021
From: CHANG, JOSEPHINE B.; DORIS, BRUCE B.; GUILLORN, MICHAEL A.; LAUER, ISAAC
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 056161/0507 →
Assignment of Assignor's Interest May 6, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 056161/0575 →
Assignment of Assignor's Interest May 24, 2021
From: BURNS, SEAN D.; CLEVENGER, LAWRENCE A.; COLBURN, MATTHEW E.; FELIX, NELSON M.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 056332/0177 →
Assignment of Assignor's Interest May 24, 2021
From: CHENG, KANGGUO; LI, JUNTAO; WU, HENG; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 056333/0062 →
Assignment of Assignor's Interest May 24, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 056333/0078 →
Assignment of Assignor's Interest May 24, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 056332/0250 →
Assignment of Assignor's Interest Jun 7, 2021
From: BRIGGS, BENJAMIN D.; CLEVENGER, LAWRENCE A.; DEPROSPO, BARTLET H.; HUANG, HUAI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 056511/0911 →
Assignment of Assignor's Interest Jun 7, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 056459/0673 →
Assignment of Assignor's Interest Jun 11, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 056512/0448 →
Assignment of Assignor's Interest Jun 11, 2021
From: BERGENDAHL, MARC A.; CHENG, KANGGUO; LIE, FEE LI; MILLER, ERIC R.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 056512/0404 →
Assignment of Assignor's Interest Jun 28, 2021
From: LIE, FEE LI; SHAO, DONGBING; WONG, ROBERT C.; XU, YONGAN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 057632/0306 →