Selective recessing to form a fully aligned via
A method of forming a semiconductor device having a vertical metal line interconnect (via) fully aligned to a first direction of a first interconnect layer and a second direction of a second interconnect layer in a selective recess region by forming a plurality of metal lines in a first dielectric layer; and recessing in a recess region first portions of the plurality of metal lines such that top surfaces of the first portions of the plurality of metal lines are below a top surface of the first dielectric layer; wherein a non-recess region includes second portions of the plurality of metal lines that are outside the recess region.
1. A device comprising:
an interconnect structure comprising first and second metal lines formed in a first dielectric layer, wherein:
the second metal line extends parallel to the first metal line in a first direction;
the second metal line is disposed adjacent to the first metal line;
a first region comprises a first segment of the first metal line;
a second region comprises a first segment of the second metal line;
a third region comprises a second segment of the first metal line;
the second region is adjacent to the first region;
the third region adjacent to the first region and the second region; and
a top surface of the first segment of the first metal line is recessed relative to a top surface of the first dielectric layer, relative to a top surface of the first segment of the second metal line, and relative to a top surface of the second segment of the first metal line.
2. The device of claim 1 , wherein:
the third region comprises a second segment of the second metal line; and
the top surface of the first segment of the second metal line is substantially coplanar with a top surface of the second segment of the second metal line.
3. The device of claim 2 , wherein:
the first region and the second region are disposed between the third region and a fourth region;
the fourth region comprises a third segment of the first metal line and a third segment of the second metal line;
the top surface of the first segment of the first metal line is recessed relative to a top surface of the third segment of the first metal line; and
the top surface of the first segment of the second metal line is substantially coplanar with a top surface of the third segment of the second metal line.
4. The device of claim 2 , further comprising a third metal line which (i) extends in the first direction, (ii) is formed in the first dielectric layer, (iii) is located in-line with the second metal line, and (iv) comprises a line-end adjacent to a line-end of the second metal line wherein:
the second region is disposed between the third region and a fourth region;
the fourth region comprises a first segment of the third metal line;
the fourth region is adjacent to the second region; and
the first segment of the third metal line is recessed relative to the top surface of the first dielectric layer and relative to the top surface of the first segment of the second metal line.
5. The device of claim 4 , further comprising:
an interlayer dielectric layer disposed on the first dielectric layer; and
a via through the interlayer dielectric layer connected to the first segment of the second metal line.
6. The device of claim 1 , further comprising:
an interlayer dielectric layer disposed on the first dielectric layer; and
a via through the interlayer dielectric layer connected to the first segment of the second metal line.
7. The device of claim 6 , wherein the first region further comprises a void in the interlayer dielectric layer above the first segment of the first metal line.
8. The device of claim 6 , wherein:
the interlayer dielectric layer comprises (i) a cap layer and (ii) a second dielectric layer disposed on the cap layer;
the cap layer comprises one or more first materials;
the second dielectric layer comprises one or more second materials; and
at least one of the one or more first materials is different from at least one of the one or more second materials.
9. The device of claim 8 , wherein the cap layer comprises silicon and nitrogen.
10. The device of claim 8 , wherein the cap layer comprises silicon, nitrogen, and carbon.
11. The device of claim 8 , wherein the cap layer comprises a metal oxide.
12. The device of claim 8 , wherein the second dielectric layer comprises a first one of the one or more second materials and a second one of the one or more second materials, the first one of the one or more second materials filling an area in which the top surface of the first metal line is recessed with respect to the top surface of the first dielectric layer, and the second one of the one or more second materials disposed on (i) the first one of the one or more second materials and (ii) the cap layer.
13. The device of claim 12 , wherein the first one of the one or more second materials is a high-k dielectric.
14. A device comprising:
an interconnect structure comprising first, second, and third metal lines formed in a first dielectric layer, wherein:
the second metal line extends parallel to the first metal line in a first direction;
the third metal line extends parallel to the second metal line in the first direction;
the second metal line is disposed (i) adjacent to the first metal line and the third metal line and (ii) between the first metal line and the third metal line;
a first region comprises a first segment of the first metal line;
a second region comprises a first segment of the second metal line;
a third region comprises a first segment of the third metal line;
a fourth region comprises a second segment of the first metal line;
the second region is adjacent to and between each of the first and third regions;
the fourth region adjacent to the first region, the second region, and the third region;
a top surface of the first segment of the first metal line is recessed relative to a top surface of the first dielectric layer, relative to a top surface of the first segment of the second metal line, and relative to a top surface of the second segment of the first metal line; and
a top surface of the first segment of the third metal line is recessed relative to the top surface of the first dielectric layer and relative to the top surface of the first segment of the second metal line.
15. The device of claim 14 , wherein:
the fourth region comprises a second segment of the second metal line, and a second segment of the third metal line;
the top surface of the first segment of the second metal line is substantially coplanar with a top surface of the second segment of the second metal line; and
the top surface of the first segment of the third metal line is recessed relative to a top surface of the second segment of the third metal line.
16. The device of claim 15 , wherein:
a fifth region comprises (i) a third segment of the first metal line, (ii) a third segment of the second metal line, and (ii) a third segment of the third metal line;
the first, second, and third regions are disposed between the fourth and fifth regions;
the top surface of the first segment of the first metal line is recessed relative to a top surface of the third segment of the first metal line;
the top surface of the first segment of the second metal line is substantially coplanar with a top surface of the third segment of the second metal line; and
the top surface of the first segment of the third metal line is recessed relative to a top surface of the third segment of the third metal line.
17. The device of claim 15 , further comprising
a fourth metal line which (i) extends in the first direction, (ii) is formed in the first dielectric layer, (iii) is located in-line with the second metal line, and (iv) comprises a line-end adjacent to a line-end of the second metal line, wherein:
the second region is disposed between the fourth region and a fifth region;
the fifth region comprises a first segment of the fourth metal line;
the fifth region (i) is adjacent to the second region; and
the first segment of the fourth metal line is recessed relative to the top surface of the first dielectric layer and relative to the top surface of the first segment of the second metal line.
18. The device of claim 17 , further comprising:
an interlayer dielectric layer disposed on (i) the first dielectric layer, (ii) the first metal line, (iii) the second metal line, (iv) the third metal line, and (v) the fourth metal line; and
a via through the interlayer dielectric layer connecting to the first segment of the second metal line.
19. The device of claim 14 , further comprising:
an interlayer dielectric layer disposed on (i) the first dielectric layer, (ii) the first metal line, (iii) the second metal line, and (iv) the third metal line; and
a via through the interlayer dielectric layer connecting to the first segment of the second metal line.
20. The device of claim 19 , wherein a void is disposed in the interlayer dielectric layer above the first segment of the first metal line in the first region and the third region comprises a void in the interlayer dielectric layer above the first segment of the third metal line.
21. The device of claim 19 , wherein:
the interlayer dielectric layer comprises (i) a cap layer and (ii) a second dielectric layer disposed on the cap layer;
the cap layer comprises one or more first materials;
the second dielectric layer comprises one or more second materials; and
at least one of the one or more first materials is different from at least one of the one or more second materials.
22. The device of claim 21 , wherein the cap layer comprises silicon and nitrogen.
23. The device of claim 21 , wherein the cap layer comprises silicon, nitrogen, and carbon.
24. The device of claim 21 , wherein the cap layer comprises a metal oxide.
25. The device of claim 21 , wherein:
the second dielectric layer comprises a first one of the one or more second materials and a second one of the one or more second materials;
the first one of the one or more second materials is disposed an area in which the top surface of the first metal line is recessed with respect to the top surface of the first dielectric layer; and
the second one of the one or more second materials disposed on (i) the first one of the one or more second materials and (ii) the cap layer.
26. The device of claim 25 , wherein the first one of the one or more second materials is a high-k dielectric.