Patent Assignment
Reel/Frame 056511/0911
Assignment of Assignor's Interest
Recorded: 2021-06-07
Pages: 5
Assignors
BRIGGS, BENJAMIN D.
Executed: 2016-06-30
CLEVENGER, LAWRENCE A.
Executed: 2016-06-30
DEPROSPO, BARTLET H.
Executed: 2016-06-30
HUANG, HUAI
Executed: 2016-06-30
PENNY, CHRISTOPHER J.
Executed: 2016-06-30
RIZZOLO, MICHAEL
Executed: 2016-06-30
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
1 ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Semiconductor Device Including a Porous Dielectric Layer, and Method of Forming the Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 7, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 056459/0673 →
Change of Name
Aug 3, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061067/0709 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0448 →