IP Library Assignment 058456/0290
Patent Assignment
Reel/Frame 058456/0290

Assignment of Assignor's Interest

Recorded: 2021-12-22 Pages: 8
Assignors
LAMBORN, DANIEL R.
Executed: 2021-04-27
SUN, CHUAN
Executed: 2021-04-27
ZHOU, QI
Executed: 2021-05-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Non-Conductive Etch Stop Structures for Memory Applications with Large Contact Height Differential
Application: 17/441,217 →
Publication: US 2022/0148971
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 2, 2024
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 067305/0491 →
Assignment of Assignor's Interest Sep 18, 2025
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 072293/0744 →