IP Library Assignment 072293/0744
Patent Assignment
Reel/Frame 072293/0744

Assignment of Assignor's Interest

Recorded: 2025-09-18 Pages: 13
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
INTEL NDTM US LLC
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties (16)
Via-Configurable High-Performance Logic Block Involving Transistor Chains
Patent: 8,957,398 →
Application: 13/649,510 →
Publication: US 2014/0028348
Non-Volatile Memory Using a Reduced Number of Interconnect Terminals
Application: 15/843,545 →
Publication: US 2019/0042087
Semiconductor Layer Between Source/Drain Regions and Gate Spacers
Application: 15/983,540 →
Publication: US 2019/0355811
Word Line with Air-Gap for Non-Volatile Memories
Application: 16/024,199 →
Publication: US 2020/0006433
Ferroelectric or Anti-Ferroelectric Trench Capacitor with Spacers for Sidewall Strain Engineering
Application: 16/440,609 →
Publication: US 2020/0395460
Hardened Plug for Improved Shorting Margin
Application: 16/465,526 →
Publication: US 2020/0098629
Back End of Line Integration for Self-Aligned Vias
Application: 16/880,744 →
Publication: US 2021/0366823
Source or Drain Structures with High Germanium Concentration Capping Layer
Application: 16/913,320 →
Publication: US 2021/0407851
Endurance Aware Data Placement in Storage System with Multiple Types of Media
Application: 17/084,301 →
Publication: US 2021/0048962
Contact Over Active Gate Structures with Tapered Gate or Trench Contact for Advanced Integrated Circuit Structure Fabrication
Application: 17/123,677 →
Publication: US 2022/0190128
Transistor Arrangements with Stacked Trench Contacts and Gate Straps
Application: 17/123,828 →
Publication: US 2022/0190129
Overcoming Error Correction Coding Mis-Corrects in Non-Volatile Memory
Application: 17/133,995 →
Publication: US 2021/0117270
Dynamic Detection and Dynamic Adjustment of Sub-Threshold Swing in a Memory Cell Sensing Circuit
Application: 17/134,010 →
Publication: US 2022/0208286
Disk Caching and/or Tiering with Device Internal Busy Information
Application: 17/313,529 →
Publication: US 2021/0255955
Non-Conductive Etch Stop Structures for Memory Applications with Large Contact Height Differential
Application: 17/441,217 →
Publication: US 2022/0148971
3D Memory Device with Top Wordline Contact Located in Protected Region During Planarization
Application: 17/442,582 →
Publication: US 2022/0189976
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 30, 2013
From: ANDREEV, ALEXANDER; GRIBOK, SERGEY; SCEPANOVIC, RANKO L.; TAN, PHEY-CHUIN
To: EASIC CORPORATION
Reel/Frame 029719/0912 →
Assignment of Assignor's Interest Apr 9, 2018
From: ZHU, ZHENYU; GAN, CHAI HUAT; HUNSAKER, MIKAL
To: INTEL CORPORATION
Reel/Frame 045484/0001 →
Corrective Assignment to Correct the Address of Assignee Previously Recorded on Reel 045484 Frame 0001. Assignor(S) Hereby Confirms the Assignment. Apr 11, 2018
From: ZHU, ZHENYU; GAN, CHAI HUAT; HUNSAKER, MIKAL
To: INTEL CORPORATION
Reel/Frame 045909/0856 →
Assignment of Assignor's Interest Jun 6, 2018
From: MEHANDRU, RISHABH; BOWONDER, ANUPAMA; GUHA, BISWAJEET; GHANI, TAHIR
To: INTEL CORPORATION
Reel/Frame 046004/0155 →
Assignment of Assignor's Interest Jul 24, 2018
From: MAJHI, PRASHANT; DOYLE, BRIAN; PILLARISETTY, RAVI; SHARMA, ABHISHEK
To: INTEL CORPORATION
Reel/Frame 046436/0218 →
Assignment of Assignor's Interest Mar 11, 2019
From: EASIC CORPORATION
To: INTEL CORPORATION
Reel/Frame 048559/0162 →
Assignment of Assignor's Interest Apr 22, 2019
From: LIAO, SZUYA S.; PATEL, PRATIK A.
To: INTEL CORPORATION
Reel/Frame 048957/0662 →
Assignment of Assignor's Interest Jun 13, 2019
From: HARATIPOUR, NAZILA; CHANG, SOU-CHI; LIN, CHIA-CHING; KAVALIEROS, JACK
To: INTEL CORPORATION
Reel/Frame 049463/0648 →
Assignment of Assignor's Interest May 21, 2020
From: BOUCHE, GUILLAUME; WEI, ANDY CHIH-HUNG
To: INTEL CORPORATION
Reel/Frame 052728/0727 →
Assignment of Assignor's Interest Oct 29, 2020
From: KARKRA, KAPIL; BARCZAK, MARIUSZ; WYSOCZANSKI, MICHAL; TRIKA, SANJEEV
To: INTEL CORPORATION
Reel/Frame 054216/0001 →
Assignment of Assignor's Interest Nov 5, 2020
From: BOMBERGER, CORY; VISHWANATH, SURESH; TOLSTOVA, YULIA; PATEL, PRATIK
To: INTEL CORPORATION
Reel/Frame 054290/0747 →
Assignment of Assignor's Interest Dec 16, 2020
From: WEI, ANDY CHIH-HUNG; PARK, CHANGYOK; BOUCHE, GUILLAUME; RYU, HYUK JU
To: INTEL CORPORATION
Reel/Frame 054669/0884 →
Assignment of Assignor's Interest Jan 27, 2021
From: PARAT, KRISHNA K.; MOTWANI, RAVI H.; SHENOY, ROHIT S.; KHAKIFIROOZ, ALI
To: INTEL CORPORATION
Reel/Frame 055053/0499 →
Assignment of Assignor's Interest Feb 9, 2021
From: AMEEN BESHARI, TAREK AHMED; RAJWADE, SHANTANU R.; AMANI, MATIN; RAMANAN, NARAYANAN
To: INTEL CORPORATION
Reel/Frame 055195/0792 →
Assignment of Assignor's Interest Apr 26, 2021
From: WALLACE, CHARLES H.; HARAN, MOHIT K.; WEI, ANDY CHIH-HUNG
To: INTEL CORPORATION
Reel/Frame 056042/0783 →
Assignment of Assignor's Interest Dec 22, 2021
From: LAMBORN, DANIEL R.; SUN, CHUAN; ZHOU, QI
To: INTEL CORPORATION
Reel/Frame 058456/0290 →
Assignment of Assignor's Interest Mar 1, 2023
From: TRIKA, SANJEEV; WYSOCKI, PIOTR
To: INTEL CORPORATION
Reel/Frame 062835/0836 →
Assignment of Assignor's Interest May 2, 2024
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 067305/0491 →