IP Library Assignment 058497/0976
Patent Assignment
Reel/Frame 058497/0976

Assignment of Assignor's Interest

Recorded: 2021-12-29 Pages: 8
Assignors
SHIBATA, TOMOAKI
Executed: 2021-11-24
OGAWA, TSUYOSHI
Executed: 2021-12-12
YONEDA, SATOSHI
Executed: 2021-11-24
LI, XINRONG
Executed: 2021-11-29
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Method for Manufacturing Electronic Component Device and Electronic Component Device
Application: 17/612,321 →
Publication: US 2022/0246597
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →