Patent Assignment
Reel/Frame 058505/0185
Assignment of Assignor's Interest
Recorded: 2021-12-30
Pages: 6
Assignors
SHIN, KEUNWOOK
Executed: 2021-12-06
SHIN, JUNGHOO
Executed: 2021-12-06
BYUN, KYUNG-EUN
Executed: 2021-12-06
SHIN, HYEONJIN
Executed: 2021-12-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnect Structure and Electronic Device Including the Same