Patent Assignment
Reel/Frame 058512/0289
Assignment of Assignor's Interest
Recorded: 2021-12-30
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Manufacturing Semiconductor Package