Patent Assignment
Reel/Frame 058526/0050
Assignment of Assignor's Interest
Recorded: 2022-01-03
Pages: 3
Assignors
YEONG, SAI-HOOI
Executed: 2021-11-19
CHUI, CHI ON
Executed: 2021-11-15
WANG, SHENG-CHEN
Executed: 2021-11-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Manufacturing Three-Dimensional Memory Devices with Conductive Spacers