Patent Assignment
Reel/Frame 058561/0046
Assignment of Assignor's Interest
Recorded: 2022-01-05
Pages: 9
Assignors
GOMES, WILFRED
Executed: 2017-12-18
BOHR, MARK T.
Executed: 2017-12-18
KUMAR, RAJESH
Executed: 2018-10-27
SANKMAN, ROBERT L.
Executed: 2017-12-21
MAHAJAN, RAVINDRANATH V.
Executed: 2017-12-19
MC CULLOUGH, WESLEY D.
Executed: 2018-03-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Distributed Semiconductor Die and Package Architecture