Distributed semiconductor die and package architecture
The present disclosure is directed to systems and methods of conductively coupling a plurality of relatively physically small core dies to a relatively physically larger base die using an electrical mesh network that is formed in whole or in part in, on, across, or about all or a portion of the base die. Electrical mesh networks beneficially permit the positioning of the cores in close proximity to support circuitry carried by the base die. The minimal separation between the core circuitry and the support circuitry advantageously improves communication bandwidth while reducing power consumption. Each of the cores may include functionally dedicated circuitry such as processor core circuitry, field programmable logic, memory, or graphics processing circuitry. The use of core dies beneficially and advantageously permits the use of a wide variety of cores, each having a common or similar interface to the electrical mesh network.
1. A method, comprising:
forming a first plurality of conductors on an upper surface of a base die;
forming a second plurality of conductors on the upper surface of the base die, wherein:
each of the first plurality of conductors is disposed on the upper surface of the base die and is spaced apart from the remaining first plurality of conductors;
each of the second plurality of conductors is disposed on the upper surface of the base die and is spaced apart from the remaining second plurality of conductors; and
each of the first plurality of conductors intersects and conductively couples to at least one of the second plurality of conductors to form an electrical mesh network on the upper surface of the base die, the electrical mesh network conductively coupled to circuitry included in the base die;
conductively coupling each of a plurality of cores to a node formed by an intersection of one of the first plurality of conductors with one of the second plurality of conductors, wherein each of the plurality of cores comprises processor core circuitry.
2. The method of claim 1 wherein forming a second plurality of conductors on the upper surface of the base die further comprises:
forming the second plurality of conductors on the upper surface of the base die such that each of the second plurality of conductors are disposed orthogonally to at least one of the first plurality of conductors.
3. The method of claim 1 wherein forming a second plurality of conductors on the upper surface of the base die further comprises:
forming the second plurality of conductors on the upper surface of the base die such that each of the second plurality of conductors are disposed orthogonally to each of the first plurality of conductors.
4. The method of claim 1 wherein forming a second plurality of conductors on the upper surface of the base die further comprises:
forming the second plurality of conductors on the upper surface of the base die such that each of the second plurality of conductors intersects and conductively couples to each of the first plurality of conductors.
5. The method of claim 1 , further comprising:
forming, in the base die, a plurality of through-silicon-vias (TSV)s that conductively couple at least one of: the electrical mesh network and the I/O circuitry to contact pads disposed on the lower surface of the base die.
6. The method of claim 1 , further comprising:
forming at least one active element proximate the upper surface of the base die.
7. The method of claim 6 , wherein forming at least one active element proximate the upper surface of the base die further comprises:
forming at least one transistor proximate the upper surface of the base die.
8. The method of claim 7 , further comprising:
conductively coupling the at least one transistor to the electrical mesh network.
9. The method of claim 1 , further comprising:
forming at least one transistor proximate a lower surface of at least some of the plurality of cores; and
conductively coupling each of the at least one transistors proximate the lower surface of at least some of the plurality of cores to the electrical mesh network.
10. The method of claim 1 :
wherein forming a first plurality of conductors on an upper surface of a base die further comprises: patterning each of the first plurality of conductors on the upper surface of the base die;
wherein forming a second plurality of conductors on an upper surface of a base die further comprises patterning each of the second plurality of conductors on the upper surface of the base die.
11. The method of claim 1 , further comprising:
forming at least one of: input/output (I/O) circuitry, voltage regulator circuitry, controller circuitry, and memory circuitry in the base die.
12. The method of claim 1 , further comprising:
forming input/output circuitry in the base die; and
conductively coupling, via the electrical mesh network, the I/O circuitry in the base die to the processor core circuitry included in at least one of the plurality of cores.