IP Library › Assignment 058591/0629
Patent Assignment
Reel/Frame 058591/0629

Security Interest

Recorded: 2022-01-10 Pages: 5
Assignor
Assignee
FIRST MERCHANTS BANK
200 E. JACKSON ST, MUNCIE, INDIANA, 47305
Covered Property (1)
Inorganic Lift-Off Profile Process For Semiconductor Wafer Processing
Application: 16/176,272 →
Publication: US 2019/0131168
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 31, 2018
From: PEARCE, LEON BENTON; SILVEIRA, GLENN ANTHONY
To: SEMI AUTOMATION & TECHNOLOGIES, INC.
Reel/Frame 047370/0007 →
Security Interest Jan 13, 2022
From: SEMI AUTOMATION & TECHNOLOGIES, LLC
To: CENTERFIELD CAPITAL PARTNERS IV, L.P., AS AGENT
Reel/Frame 058651/0641 →
Security Interest Nov 12, 2024
From: SEMI AUTOMATION & TECHNOLOGIES, LLC
To: BAIN CAPITAL CREDIT, LP, AS ADMINISTRATIVE AGENT
Reel/Frame 069229/0445 →
Release of Security Interest Nov 12, 2024
From: FIRST MERCHANTS BANK
To: SEMI AUTOMATION & TECHNOLOGIES, LLC
Reel/Frame 069236/0411 →
Release of Security Interest Nov 13, 2024
From: CENTERFIELD CAPITAL PARTNERS IV, L.P.
To: SEMI AUTOMATION & TECHNOLOGIES, LLC
Reel/Frame 069251/0337 →