Patent Assignment
Reel/Frame 058617/0364
Assignment of Assignor's Interest
Recorded: 2022-01-11
Pages: 7
Assignors
ZHANG, TONGLONG
Executed: 2022-01-10
ZHANG, XIAODONG
Executed: 2022-01-10
GUAN, YONG
Executed: 2022-01-10
LI, HENG
Executed: 2022-01-11
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, CHINA
Covered Property
(1)
Chip Package Structure and Chip Packaging Method