Patent Assignment
Reel/Frame 058645/0784
Assignment of Assignor's Interest
Recorded: 2022-01-13
Pages: 5
Assignors
CHIU, CHIH-HSIEN
Executed: 2022-01-06
CHANG, KO-WEI
Executed: 2022-01-06
TSAI, WEN-JUNG
Executed: 2022-01-06
YU, CHE-WEI
Executed: 2022-01-06
CHEN, CHIA-YANG
Executed: 2022-01-06
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO.123, SEC. 3, DAFENG RD., TANZI DIST., TAICHUNG CITY, 427, TAIWAN
Covered Property
(1)
Electronic Package and Manufacturing Method Thereof