Patent Assignment
Reel/Frame 058647/0640
Assignment of Assignor's Interest
Recorded: 2022-01-13
Pages: 10
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Method, Substrate Processing Apparatus, and Recording Medium