IP Library › Assignment 058656/0723
Patent Assignment
Reel/Frame 058656/0723

Assignment of Assignor's Interest

Recorded: 2022-01-14 Pages: 8
Assignors
LIN, CHIUNG-YUAN
Executed: 2021-12-17
YANG, TSUNG-FU
Executed: 2021-12-17
CHU, WEICHENG
Executed: 2021-12-16
CHANG, CHING LIANG
Executed: 2021-12-16
CHOU, CHEN HAN
Executed: 2021-12-17
YANG, CHIA-HO
Executed: 2021-12-16
LIN, TSUNG-KAI
Executed: 2021-12-16
LIN, TSUNG-HAN
Executed: 2021-12-16
CHUNG, CHIH-HUNG
Executed: 2021-12-16
HU, CHENMING
Executed: 2021-12-14
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
NATIONAL YANG MING CHIAO TUNG UNIVERSITY
NO.1001, DAXUE RD., EAST DIST., HSINCHU CITY, 300, TAIWAN
Covered Property (1)
Semiconductor Device Having a 2-D Material Layer Including a Channel Region and Source/Drain Regions and Method for Forming the Same
Application: 17/575,147 →
Publication: US 2023/0023186