Semiconductor device having a 2-D material layer including a channel region and source/drain regions and method for forming the same
A semiconductor device includes a substrate, a 2-D material layer, source/drain contacts, and a gate electrode. The 2-D material layer is over the substrate, the 2-D material layer includes source/drain regions and a channel region between the source/drain regions, in which the 2-D material layer is made of a transition metal dichalcogenide (TMD). The source/drain contacts are in contact with source/drain regions of the 2-D material layer, in which a binding energy of transition metal atoms at the channel region of the 2-D material layer is different from a binding energy of the transition metal atoms at the source/drain regions of the 2-D material layer. The gate electrode is over the substrate.
1. A semiconductor device, comprising:
a substrate;
a 2-D material layer over the substrate, the 2-D material layer comprising source/drain regions and a channel region between the source/drain regions, wherein the 2-D material layer is made of a transition metal dichalcogenide (TMD);
source/drain contacts in contact with the source/drain regions of the 2-D material layer, wherein a binding energy of transition metal atoms at the channel region of the 2-D material layer is different from a binding energy of the transition metal atoms at the source/drain regions of the 2-D material layer, and wherein along a vertical direction, metal atoms of the source/drain contacts and the transition metal atoms at the source/drain regions of the 2-D material layer are free of chalcogen atoms interposed therebetween; and
a gate electrode over the substrate.
2. The semiconductor device of claim 1 , wherein metal atoms of the source/drain contacts are the same as the transition metal atoms of the 2-D material layer.
3. The semiconductor device of claim 1 , wherein a work function value of a metal of the source/drain contacts is larger than a work function value of a transition metal of the 2-D material layer.
4. The semiconductor device of claim 1 , wherein one of the source/drain contacts is in contact with a top surface of the 2-D material layer and a sidewall of the 2-D material layer.
5. The semiconductor device of claim 1 , wherein one of the source/drain contacts is in contact with a top surface of the 2-D material layer, a sidewall of the 2-D material layer, and a bottom surface of the 2-D material layer.
6. The semiconductor device of claim 1 , wherein one of the source/drain contacts has a portion extending to a bottom surface of the 2-D material layer, and wherein along the vertical direction, metal atoms of the portion of the one of the source/drain contacts and the transition metal atoms at the source/drain regions of the 2-D material layer are free of chalcogen atoms interposed therebetween.
7. The semiconductor device of claim 1 , further comprising a gate dielectric layer vertically between the 2-D material layer and the substrate, and the gate electrode is disposed on a back side of the substrate that is opposite to the gate dielectric layer.
8. The semiconductor device of claim 1 , wherein a binding energy of the transition metal atoms at a first portion of the source/drain regions of the 2-D material layer is different from a binding energy of the transition metal atoms at a second portion of the source/drain regions of the 2-D material layer.
9. A semiconductor device, comprising:
a substrate;
a 2-D material layer over the substrate, wherein the 2-D material layer is made of a transition metal dichalcogenide (TMD);
source/drain contacts over the substrate, wherein each of the source/drain contacts extends through the 2-D material layer, wherein each of the source/drain contacts comprises a first metal layer in contact with a respective source/drain region of the 2-D material layer and a second metal layer over the first metal layer, and wherein metal atoms of the first metal layer of each of the source/drain contacts and transition metal atoms at the respective source/drain region of the 2-D material layer are free of chalcogen atoms interposed therebetween; and
a gate electrode over the substrate.
10. The semiconductor device of claim 9 , wherein the first metal layer is made of a same metal as a transition metal of the 2-D material layer.
11. The semiconductor device of claim 10 , wherein the second metal layer is made of a different metal than the transition metal of the 2-D material layer.
12. The semiconductor device of claim 11 , wherein a work function value of the second metal layer is larger than a work function value of the transition metal of the 2-D material layer.
13. The semiconductor device of claim 9 , further comprising a gate dielectric layer vertically between the substrate and the 2-D material layer, wherein the source/drain contacts are in contact with the gate dielectric layer.
14. The semiconductor device of claim 13 , wherein the gate dielectric layer and the gate electrode are on opposite sides of the substrate.
15. The semiconductor device of claim 9 , wherein the first metal layer cups an underside of the second metal layer.
16. A method, comprising:
forming a 2-D material layer over a substrate, wherein a monolayer of the 2-D material layer comprises a middle layer of transition metal atoms, a top layer of chalcogen atoms, and a bottom layer of chalcogen atoms;
forming a passivation layer over the 2-D material layer, wherein the passivation layer comprises openings exposing source/drain regions of the 2-D material layer;
performing an etching process to remove chalcogen atoms from the top layer of the monolayer of the 2-D material layer through the openings of the passivation layer;
forming source/drain contacts in the openings of the passivation layer; and
forming a gate electrode over the substrate.
17. The method of claim 16 , further comprising removing chalcogen atoms from the bottom layer of the monolayer of the 2-D material layer, while leaving the middle layer of transition metal atoms intact.
18. The method of claim 16 , wherein the etching process etches through the 2-D material layer, and forming the source/drain contacts comprises:
depositing a first metal layer in the openings of the passivation layer, wherein the first metal layer is made of a same material as a transition metal of the 2-D material layer; and
depositing a second metal layer over the first metal layer, wherein the second metal layer is made of a different material than the first metal layer.
19. The method of claim 18 , wherein the openings of the passivation layer exposes sidewalls of the 2-D material layer, and the source/drain contacts are in contact with the sidewalls of the 2-D material layer.
20. The method of claim 16 , wherein after the etching process is completed, the middle layer of transition metal atoms remains substantially intact.