Patent Assignment
Reel/Frame 058660/0584
Assignment of Assignor's Interest
Recorded: 2022-01-14
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure of Semiconductor Device and Method of Forming Same