IP Library › Assignment 058669/0907
Patent Assignment
Reel/Frame 058669/0907

Assignment of Assignor's Interest

Recorded: 2022-01-17 Pages: 5
Assignors
LEE, YEONJIN
Executed: 2022-01-03
LEE, JONGMINN
Executed: 2022-01-03
LEE, JEONIL
Executed: 2022-01-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device Including via Structure and Method for Manufacturing the Same
Application: 17/574,902 →
Publication: US 2023/0005818
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the Second Inventors Name Previously Recorded at Reel: 058669 Frame: 0907. Assignor(S) Hereby Confirms the Assignment. Aug 9, 2022
From: LEE, YEONJIN; LEE, JONGMIN; LEE, JEONIL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061119/0278 →