Patent Assignment
Reel/Frame 058671/0485
Assignment of Assignor's Interest
Recorded: 2022-01-17
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Interconnection Structures and Methods of Forming the Same