Patent Assignment
Reel/Frame 058674/0386
Assignment of Assignor's Interest
Recorded: 2022-01-18
Pages: 12
Assignors
WANG, CHIA-LING
Executed: 2022-01-05
CHIANG, PING-HUNG
Executed: 2022-01-05
HUANG, WEI-LUN
Executed: 2022-01-05
LU, CHIA-WEN
Executed: 2022-01-05
CHIU, TA-WEI
Executed: 2022-01-05
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Fabrication Method Thereof