Patent Assignment
Reel/Frame 058679/0376
Assignment of Assignor's Interest
Recorded: 2022-01-18
Pages: 5
Assignors
CHEN, HAN-DE
Executed: 2022-01-17
CHU, CHENG-I
Executed: 2022-01-13
TENG, YUN CHEN
Executed: 2022-01-17
TSAI, CHEN-FONG
Executed: 2022-01-13
SHEU, JYH-CHERNG
Executed: 2022-01-13
CHANG, HUICHENG
Executed: 2022-01-13
YEO, YEE-CHIA
Executed: 2022-01-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Dynamic Bonding Gap Control and Tool for Wafer Bonding