Patent Assignment
Reel/Frame 058687/0172
Assignment of Assignor's Interest
Recorded: 2022-01-19
Pages: 3
Assignors
TANG, SHIH-WEN
Executed: 2021-11-24
BELONIO, JESUS MENNEN
Executed: 2021-11-25
LI, CHE-HAN
Executed: 2021-11-25
Assignee
DIALOG SEMICONDUCTOR (UK) LIMITED
TOWER BRIDGE HOUSE, ST. KATHARINE'S WAY, LONDON, E1W 1AA, UNITED KINGDOM
Covered Property
(1)
3D MIS-FO Hybrid for Embedded Inductor Package Structure