3D MIS-FO hybrid for embedded inductor package structure
An inductor package is described comprising a mold interconnection substrate having an embedded spiral coil inductor, a fan-out redistribution layer connected to the spiral coil inductor by a copper post wiring structure, a ferrite toroid coil in between the copper posts, and a semiconductor die mounted on the mold interconnection substrate and connected to the fan-out redistribution layer.
1. An inductor package comprising:
a mold interconnection substrate having an embedded spiral coil inductor each layer of said spiral coil inductor having a thickness in the range of between 20 μm and 60 μm;
a fan-out redistribution layer connected to said spiral coil inductor by a copper post wiring structure;
a ferrite toroid coil in between said copper posts configured to increase inductance of said embedded spiral coil inductor; and
a semiconductor die mounted on said mold interconnection substrate and connected to said fan-out redistribution layer.
2. The package according to claim 1 wherein said spiral coil inductor comprises copper.
3. The package according to claim 1 wherein said spiral coil inductor has at least one layer and up to about six layers of copper.
4. The package according to claim 1 wherein said fan-out redistribution layer comprises at least two metal redistribution layers separated by a dielectric layer.
5. The package according to claim 1 wherein said fan-out redistribution layer has a thickness in the range from about 5 μm to about 20 μm per one layer of copper plating.
6. The package according to claim 1 wherein copper pillars connect circuits within said semiconductor die to said fan-out redistribution layer.
7. The package according to claim 1 wherein said ferrite toroid coil comprises ferrite combined with cobalt, nickel, zirconium, tantalum, niobium, rhenium, neodymium, praseodymium and/or manganese compounds.
8. The package according to claim 1 further comprising an epoxy molding compound surrounding said ferrite toroid coil and copper posts between said mold interconnect substrate and said fan-out redistribution layer.
9. The package according to claim 1 further comprising solder balls connected to said fan-out redistribution layer on a side opposite to said copper post wiring structure.
10. An inductor package comprising:
a mold interconnection substrate having an embedded spiral coil inductor each layer of said spiral coil inductor having a thickness in the range of between 20 μm and 60 μm;
a hybrid wiring structure surrounding a magnetic core on said mold interconnection substrate wherein said hybrid wiring structure surrounding said magnetic core comprises:
conductor traces and conductive pillars on said mold interconnection substrate and electrically connected to said embedded spiral coil inductor;
a ferrite toroid coil in between said conductive pillars on said mold interconnection substrate; and
redistribution layer structures on an opposite side of said ferrite toroid coil from said mold interconnection substrate and connecting to said conductive pillars in a molding layer; and
a semiconductor die mounted on said mold interconnection substrate on a same side od said mold interconnection substrate as said ferrite toroid coil.
11. The package according to claim 10 wherein said spiral coil inductor comprises copper.
12. The package according to claim 10 wherein said spiral coil inductor has at least one layer and up to about six layers of copper.
13. The package according to claim 10 wherein said ferrite toroid coil comprises ferrite combined with cobalt, nickel, zirconium, tantalum, niobium, rhenium, neodymium, praseodymium and/or manganese compounds.
14. The package according to claim 10 further comprising an epoxy molding compound surrounding said ferrite toroid coil and conductive pillars between said mold interconnect substrate and said fan-out redistribution layer.
15. The package according to claim 10 wherein said conductive traces and said conductive pillars comprise copper.
16. The package according to claim 10 wherein said redistribution layer structures comprise at least two metal redistribution layers separated by a dielectric layer.
17. The package according to claim 10 wherein conductive pillars connect circuits within said semiconductor die to said redistribution layer structures.
18. The package according to claim 10 further comprising solder balls connected to said redistribution layer structures on a side opposite to said conductive pillars.
19. A method for fabricating an inductor package comprising:
embedding a copper spiral inductor within a mold interconnect substrate;
forming a wiring structure of copper plates and copper posts on said mold interconnect substrate, electrically connected to said copper spiral inductor;
mounting a semiconductor die on said mold interconnect substrate;
mounting a ferrite toroid coil on said mold interconnect substrate between said copper posts;
covering said ferrite toroid coil and said semiconductor die with a molding compound wherein tops of said copper posts and copper pillars on an upper side of said semiconductor die are exposed; and
forming redistribution layer structures on said molding compound interconnecting with said copper posts and said copper pillars on an underside of said redistribution layers and providing connections outside of said package on an upper side of said redistribution layer structures.