Patent Assignment
Reel/Frame 058761/0485
Assignment of Assignor's Interest
Recorded: 2022-01-25
Pages: 6
Assignors
LEE, JINHO
Executed: 2021-12-20
KIM, YOUNSOO
Executed: 2021-12-20
KIM, HAERYONG
Executed: 2021-12-20
KIM, SUNGHYUN
Executed: 2021-12-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices and Methods of Manufacturing the Same