Patent Assignment
Reel/Frame 058765/0219
Assignment of Assignor's Interest
Recorded: 2022-01-25
Pages: 4
Assignor
NISHIMURA, TETSURO
Executed: 2022-01-08
Assignee
NIHON SUPERIOR CO., LTD.
1-16-15, ESAKACHO, SUITA-SHI, OSAKA, 5640063, JAPAN
Covered Property
(1)
Solder Preform Containing Cu-Co Particles