IP Library › Granted Patent US 12,377,501
Granted Patent B2
US 12,377,501 · App. 17/630,061 · Granted Aug 5, 2025

Solder preform containing Cu—Co particles

Inventor: Tetsuro Nishimura (Osaka, JP)
Assignee: NIHON SUPERIOR CO., LTD.
B23K35/302B23K35/262C22C9/06
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Quick Facts
Patent No.
US 12,377,501
App. No.
17/630,061
Granted
Aug 5, 2025
Kind
B2
Abstract

Provided is a preformed solder including a lead-free solder mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder. The metal particle is formed of a Cu—Ni alloy having a Ni content of 0.1 to 90% by mass, or a Cu—Co alloy having a Co content of 0.1 to 90% by mass, and the lead-free solder may contain Ni when the metal particle is formed of the Cu—Ni alloy, or contains Ni when the metal particle is formed of the Cu—Co alloy, and (Cu,Ni)6Sn5 is formed on a surface of the metal particle. With this preformed solder, a bonded portion having heat resistance, thermal conductivity, and reliability higher than ever can be formed.

Claims (9)

1. A solder preform comprising:

a lead-free solder mainly comprising Sn, and

metal particles with a melting point higher than a melting point of the lead-free solder, wherein:

the lead-free solder contains Ni,

(Cu,Ni)6 Sn5 is formed on a surface of the metal particles, and

the metal particles consist of Cu—Co, have a Co content of 10 to 40% by mass,

and have an average particle diameter of 5 μm or greater.

2. The solder preform of claim 1 wherein the lead-free solder is a Sn—Cu—Ni solder.

3. The solder preform of claim 1 wherein the Co content is 20 to 35% by mass.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2022
From: NISHIMURA, TETSURO
To: NIHON SUPERIOR CO., LTD.
Reel/Frame 058765/0219 →
Priority Claims (1)
JP 2019-138325 · Jul 26, 2019 · national
Continuity (1)
Related Publication 20220274212A1 · Sep 1, 2022
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