Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part
A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.
1. A joining method for joining a first metal member having at least a surface of a first metal to a second metal member having at least a surface of a second metal with a joining material predominantly of a joining metal having a lower melting point than at least one of the first metal and the second metal sandwiched between the first metal member and the second metal member, wherein
the joining metal composing the joining material is Sn or an alloy containing Sn in an amount of 70% by weight or more, and
at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the joining metal, and which has a lattice constant difference of 50% or more from the intermetallic compound produced on the surface of at least one of the first metal and the second metal, the joining method comprising:
heat-treating the joining material located between the first metal member and the second metal member at a temperature at which the joining metal is melted to join the first metal member to the second metal member with the joining material sandwiched therebetween.
2. The joining method according to claim 1 , wherein the joining metal is Sn or an alloy containing Sn in an amount of 85% by weight or more.
3. The joining method according to claim 1 , wherein the heat treatment is performed in a state where a proportion of (b) one of the first metal and the second metal having the lattice constant difference of 50% or more in the total amount of (a) the joining metal and (b) is 30% by volume or more.
4. The joining method according to claim 1 , wherein the joining metal is Sn alone or an alloy containing Sn and at least one selected from the group consisting of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn, Pd, Si, Sr, Te and P.
5. The joining method according to claim 1 , wherein at least one of the first metal and the second metal is a Cu—Mn alloy or a Cu—Ni alloy.
6. The joining method according to claim 5 , wherein at least one of the first metal and the second metal is a Cu—Mn alloy containing Mn in a proportion of 5 to 30% by weight or a Cu—Ni alloy containing Ni in a proportion of 5 to 30% by weight.
7. The joining method according to claim 5 , wherein at least one of the first metal and the second metal is a Cu—Mn alloy containing Mn in a proportion of 10 to 15% by weight or a Cu—Ni alloy containing Ni in a proportion of 10 to 15% by weight.