Patent Assignment
Reel/Frame 058779/0928
Assignment of Assignor's Interest
Recorded: 2022-01-26
Pages: 6
Assignors
LEE, GUNHYUCK
Executed: 2022-01-25
SON, SANGHYUN
Executed: 2022-01-25
JANG, YUJEONG
Executed: 2022-01-25
LEE, HYEONEUI
Executed: 2022-01-25
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method Using Tape Attachment
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.