Patent Assignment
Reel/Frame 058797/0302
Assignment of Assignor's Interest
Recorded: 2022-01-27
Pages: 3
Assignors
HUANG, CHUN-HUNG
Executed: 2021-12-30
CHIANG, HSIN-CHE
Executed: 2021-12-08
YEH, JENG-YA
Executed: 2021-12-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same