Patent Assignment
Reel/Frame 058804/0626
Assignment of Assignor's Interest
Recorded: 2022-01-28
Pages: 5
Assignors
LIN, CHIH-HAN
Executed: 2017-09-27
TSAI, SHIH-CHANG
Executed: 2017-09-27
HSIEH, WEN-SHUO
Executed: 2017-09-27
LIU, TE-YUNG
Executed: 2017-09-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof