Patent Assignment
Reel/Frame 058846/0893
Assignment of Assignor's Interest
Recorded: 2022-02-01
Pages: 5
Assignors
TSAI, YUNG-CHIH
Executed: 2016-07-05
HSU, WEI-CHE
Executed: 2016-07-05
YANG, YU-CHUNG
Executed: 2016-07-05
KALNITSKY, ALEXANDER
Executed: 2017-04-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof