Patent Assignment
Reel/Frame 058866/0265
Assignment of Assignor's Interest
Recorded: 2022-02-02
Pages: 5
Assignor
OKAJIMA, YUSAKU
Executed: 2021-12-14
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Substrate Suppport and Method of Manufacturing Semiconductor Device