Patent Assignment
Reel/Frame 058879/0728
Assignment of Assignor's Interest
Recorded: 2022-02-03
Pages: 3
Assignors
BEAUPRÉ-LAFLAMME, RAPHAEL
Executed: 2022-02-02
PELLETIER, FRANÇOIS
Executed: 2022-02-02
BIBEAU, LOUIS-PHILIPPE
Executed: 2022-02-03
Assignee
CIENA CORPORATION
7035 RIDGE ROAD, HANOVER, MARYLAND, 21076
Covered Property
(1)
Enhanced Thermal Control of a Hybrid Chip Assembly