Patent Assignment
Reel/Frame 058933/0057
Assignment of Assignor's Interest
Recorded: 2022-02-08
Pages: 4
Assignors
HUANG, YI-CHUN
Executed: 2019-11-13
CHEN, I-CHIH
Executed: 2019-11-05
KUO, CHUN-WEI
Executed: 2019-11-07
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
TSMC NANJING COMPANY, LIMITED
16, ZIFENG ROAD, PUKOU ECONOMIC DEVELOPMENT ZONE, JIANGSU PROVINCE, NANJING, CHINA
Covered Property
(1)
Method of Back End of Line via to Metal Line Margin Improvement