Assignment of Assignor's Interest

Recorded: 2022-02-09 Pages: 3

Assignors

NARITA, MAO

Executed: 2022-01-25

ONO, KEISHI

Executed: 2022-01-25

ARAI, TATSUHIKO

Executed: 2022-01-25

KURODA, NAOTO

Executed: 2022-01-31

Assignee

SHOWA DENKO MATERIALS CO., LTD.

9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN

Covered Property (1)

Photosensitive Resin Composition, Photosensitive Resin Film, Method for Producing Cured Product, Laminate, and Electronic Component

Application: 17/624,846 →

Publication: US 2022/0267484

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.