Patent Assignment
Reel/Frame 058962/0107
Assignment of Assignor's Interest
Recorded: 2022-02-07
Pages: 33
Assignors
NIE, BAI
Executed: 2021-09-30
TADAYON, POOYA
Executed: 2021-09-30
ARANA, LEONEL R.
Executed: 2021-09-30
LI, YONGGANG
Executed: 2021-10-12
LIU, CHANGHUA
Executed: 2022-01-19
DARMAWIKARTA, KRISTOF
Executed: 2021-09-30
PIETAMBARAM, SRINIVAS VENKATA RAMANUJA
Executed: 2021-09-30
IBRAHIM, TAREK A.
Executed: 2021-09-30
MAHALINGAM, HARI
Executed: 2021-12-23
DUONG, BENJAMIN
Executed: 2021-09-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Die Last and Waveguide Last Architecture for Silicon Photonic Packaging