Patent Assignment
Reel/Frame 058967/0398
Assignment of Assignor's Interest
Recorded: 2022-02-10
Pages: 3
Assignors
WANG, SHENG-CHEN
Executed: 2021-11-23
LIN, MENG-HAN
Executed: 2021-11-23
CHIA, HAN-JONG
Executed: 2021-11-23
YANG, FENG-CHENG
Executed: 2021-11-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method of Forming the Same