Patent Assignment
Reel/Frame 058975/0070
Assignment of Assignor's Interest
Recorded: 2022-02-10
Pages: 10
Assignors
WU, WEN-HAU
Executed: 2018-12-21
CHUANG, CHUN-HAO
Executed: 2018-12-23
HASHIMOTO, KAZUAKI
Executed: 2018-12-24
CHOU, KENG-YU
Executed: 2018-12-21
CHIANG, WEI-CHIEH
Executed: 2018-12-25
HUANG, CHENG YU
Executed: 2018-12-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Wafer Level Image Sensor Package