Patent Assignment
Reel/Frame 059009/0204
Assignment of Assignor's Interest
Recorded: 2022-02-15
Pages: 5
Assignors
LEE, CHIEN-MIN
Executed: 2021-12-13
WU, CHENG-HSIEN
Executed: 2021-12-16
CHANG, CHENG-CHUN
Executed: 2021-12-13
AMBROSI, ELIA
Executed: 2021-12-13
LEE, HENGYUAN
Executed: 2022-01-19
CHEN, YING-YU
Executed: 2021-12-13
BAO, XINYU
Executed: 2021-12-13
LEE, TUNG-YING
Executed: 2021-12-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device and Manufacturing Method Thereof