Patent Assignment
Reel/Frame 059032/0271
Assignment of Assignor's Interest
Recorded: 2022-02-17
Pages: 7
Assignors
CHIANG, HUNG-LI
Executed: 2019-10-25
CHANG, CHIH-SHENG
Executed: 2019-12-25
CHEN, TZU-CHIANG
Executed: 2019-12-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
FeFET OF 3D STRUCTURE FOR CAPACITANCE MATCHING