IP Library › Assignment 059034/0419
Patent Assignment
Reel/Frame 059034/0419

Assignment of Assignor's Interest

Recorded: 2022-02-17 Pages: 4
Assignors
TSAI, YAO-JEN
Executed: 2022-01-04
CHANG, CHIH-FU
Executed: 2022-01-04
HUAG, SHENG CHIANG
Executed: 2022-01-07
KO, CHIN-YUAN
Executed: 2022-02-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Interconnect Structure and Methods of Forming the Same
Application: 17/583,789 →
Publication: US 2023/0035580
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Correct the Typo Error of the 3RD Assignor's Name Previously Recorded at Reel: 59034 Frame: 419. Assignor(S) Hereby Confirms the Assignment. Nov 28, 2024
From: TSAI, YAO-JEN; CHANG, CHIH-FU; HUNG, SHENG CHIANG; KO, CHIN-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069717/0346 →